PacTech is a worldwide leader in wafer level packaging technologies and advanced packaging equipment manufacturing with volume production facilities across 3 continents at Germany, USA, and Malaysia. With over 20 years of experience in the industry, we have received over 100 patents and built over 1000 production machines. In line with our further expansion plan in Malaysia for high volume manufacturing in wafer level packaging services, we are seeking individuals with strong background in chemical engineering, material science, backend processing and wafer level packaging for our PacTech Asia operations.