3D NAND test solution design, assessment, development, and maintenance, including hardware, software, and data analysis.
R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms.
Test Equipment bring-up and correlation for new packages, including DSA design, pin & channel mapping.
Product-specific flow creation and integration to meet HVM requirements.
R&D activities from pre-silicon to post-silicon, including Design Validation, Engineering Evaluation, Qualification Support, and Failure Analysis.
Engineering investigation and resolution on design/process/packaging issues.
RMA failure mode analysis and screen coverage improvements.
Test data correlation between platforms. Yield enhancement and test time optimization.
Collaboration internally across multiple departments, such as PE, Device, Packaging, and Design, as well as with external ATE vendors and related parties for debugging and related engineering activities.
In-house designed platform and new test equipment validation, production environment setup.
