Co-ordinate all Wafer Manufacturing related activities.
Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks.
Drive BBSC for all 3rdParty Foundries for Delivery, through put time, Yield and Quality including follow up on improvement actions
Monitor, review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BL’s and from BL’s to 3rd Party Foundries.
Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place.
Program Management 3rdParty Foundries
Define time-line, resources, risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project
Be responsible for monitoring and controlling the execution of the project as per agreed time-line
Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation, mother fab, BL) and local project team of External Foundry
Actively coordinate process qualification, product introduction and qualification
Stimulate/oversee structural problems solving by use of statistical and quality tools
Chair and organize process gate meetings
Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee)
Be the interface between NXP and External Foundries during project execution
Coordinate safe-launch and volume ramp-up implementation, monitor with support of the local technical team continuous yield & process improvement activities
General Areas Of Responsibility Include
Relation management and communication interface to all 3rdParty Foundries within their area.
Drive Quarterly review with 3rdParty Foundries including follow up on actions
Support Foundry Sourcing group in cost/price negotiations and discussions with both existing and new 3rd Party Foundries
Job Requirement
Minimum Qualifications:
Bachelor/Master in Engineering/Material Science/Electronic
Minimum 7 years working experience preferably in semiconductor fab environment (Process Integration, Device/Yield engineer preferred)
Well verse in English and Chinese
Able to work independently and also handle cross functional projects
Preferred Qualifications
Six sigma green belt and above, SPC knowledge, Semiconductor Devices and Process knowledge
