We are seeking an RF Scientist to drive innovation in advanced packaging and system integration for next-generation high-frequency devices. This role focuses on the design, modeling, and characterization of RF components within complex packaging architectures. You will contribute to cutting-edge technologies enabling high-performance applications in communications, sensing, and electronics integration.
Key Responsibilities
- Lead the design and integration of advanced RF packaging solutions (2.5D/3D interposers, FOWLP) for high-frequency and high-performance applications
- Design and optimize RF components, interconnects, and system-in-package (SiP) architectures
- Perform EM, signal integrity (SI), and power integrity (PI) simulations to ensure optimal performance (loss, crosstalk, impedance matching)
- Drive innovation in materials, architectures, and interconnect technologies for heterogeneous integration, including AI and high-performance compute systems
- Apply data-driven and AI/ML-assisted approaches to modeling, design optimization, and predictive performance/reliability analysis
- Translate R&D concepts into scalable, manufacturable solutions bridging research and productionLead experimental validation, RF characterization, and reliability analysis, including failure investigation and iterative design improvement
- Collaborate across multidisciplinary teams to co-design integrated chip–package–system solutions, including photonics, MEMS, and integrated thermal solutions, for next-generation AI, communications, and sensing platforms.
- Contribute to technology roadmaps, intellectual property (IP) development, and technical publications
Required Qualifications
- PhD or Master’s degree in Electrical Engineering, Applied Physics, or related field
- Strong background in RF/microwave engineering and electromagnetics
- Experience with RF simulation tools (e.g., HFSS, CST, ADS, or similar)
- Knowledge of semiconductor packaging technologies (e.g., flip chip, interposers, fan-out)
- Experience in RF measurement techniques (VNA, spectrum analyzer, probe stations)
- Strong analytical and problem-solving skills
Preferred Qualifications
- Experience with mmWave or high-frequency systems
- Familiarity with heterogeneous integration and system-in-package (SiP) design
- Knowledge of materials and thermal/mechanical considerations in packaging
- Programming or scripting skills (Python, MATLAB, etc.)
